Beyond the flow

After tapeout

What happens between sending the GDS and holding a working chip.

Chapter in progress

What this page will cover

Masks and fab

  • Mask data preparation and OPC
  • Lithography, EUV and multi-patterning
  • Wafer processing in brief

Test and packaging

  • Wafer sort and final test
  • Packaging, from wire bond to chiplets
  • Yield and binning

First silicon

  • Bring-up in the lab
  • Debugging with scan and on-chip instruments
  • Metal-only respins and ECOs

Meanwhile, the Synthesis, Placement and Clock tree synthesis chapters are complete.