Stage 8 of 13 · Back end

Power planning

Build the chip's power wiring so every part gets a steady supply.

Rings, straps and rails form a power delivery network across the metal layers. The goal is to keep voltage drop (IR drop) and electromigration within limits.

PDN topology and strap pitch on upper metals, via arrays, power switches for gated domains, static and dynamic IR analysis, EM limits, decap insertion, and backside power delivery at the newest nodes.

Builds The power grid