Stage 12 of 13 · Back end

Signoff

Run the final checks that prove the chip will be fast enough, can be manufactured and matches the design.

Static timing analysis across corners, physical verification (DRC and LVS), power and IR-drop analysis and equivalence checks must all pass before tapeout.

Multi-corner multi-mode STA on extracted parasitics, OCV and POCV, crosstalk, DRC, LVS, ERC and antenna, IR and EM signoff, and the ECO loops that close what's left.

Builds Proof it works